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Features
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| Double-buffered global shutter photodiode pixels |
| Simultaneous integration and readout |
| Enhanced Near-IR performance (NIR QE >35%) |
| Progressive or interlaced readout modes |
| Linear or high dynamic range pixel response |
| >99% global shutter efficiency |
| Register lock capability |
| User-Programmable window size within frame |
| 2 x 2 and 4 x 4 pixel averaging of the full resolution |
| ADC On-Chip (10-bit linear or 12-bit to 10-bit companding mode) |
| Auto exposure control (AEC) , Auto gain control (AGC), Black level calibration (BLC) |
| User-Programmable regional gain and exposure weighting (25 regions) |
| Support for 4 unique serial control register IDs to control multiple imagers on the same bus |
| Master/Slave dual sensor operation for stereoscopic, foveal, or hyperspectral operation |
| On-Chip digital thermometer |
Data output formats:
- Single sensor mode:10-bit parallel/stand-alone or 8 or 10-bit serial LVDS
- Dual sensor mode: Interspersed 8-bit serial LVDS |
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Specifications
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| Optical format 1/3-inch |
| Active imager size 4.51mm(H) x 2.88mm(V) 5.35mm Diagonal |
| Active pixels 752H x 480V |
| Pixel size 6.0µm x 6.0µm |
| Color filter array Monochrome or color RGB Bayer pattern |
| Shutter type Double-Buffered global shutter TrueSNAP™ |
| Maximum data rate 26.6 Mp/s |
| Master clock 26.6 MHz |
| Full resolution 752 x 480 |
| Frame rate 60 fps (at full resolution) |
| ADC resolution 10-bit |
| Responsivity 4.8 V/lux-sec (550nm) |
| Dynamic range >55dB linear; >80dB–100dB in HiDy Mode |
| Supply voltage 3.3V +0.3V (all supplies) |
| Power consumption <320mW at maximum data rate; 100µW standby current |
| Operating temperature –40°C to +85°C |
| Packaging 52-ball IBGA, automotive qualified; wafer or die |
